XPC850DEVR50BU

Product Overview

Category

XPC850DEVR50BU belongs to the category of microprocessors.

Use

This product is primarily used in embedded systems and industrial applications that require high-performance computing capabilities.

Characteristics

• High processing power
• Low power consumption
• Compact size
• Robust design for harsh environments

Package

XPC850DEVR50BU is available in a compact package, suitable for surface mount technology (SMT) assembly.

Essence

The essence of XPC850DEVR50BU lies in its ability to provide efficient and reliable processing power for various embedded applications.

Packaging/Quantity

This product is typically packaged in reels or trays, with quantities varying based on customer requirements.

Specifications

• Processor Type: XPC850DEVR50BU
• Clock Speed: 50 MHz
• Architecture: PowerPC
• Instruction Set: RISC
• Cache Memory: 8 KB
• Operating Voltage: 3.3V
• Package Type: BGA (Ball Grid Array)
• Number of Pins: 256
• Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The pin configuration of XPC850DEVR50BU is as follows:

| Pin Number | Pin Name | Function | |------------|----------|----------| | 1 | VCC | Power Supply (3.3V) | | 2 | GND | Ground | | 3 | RESET | Reset Signal | | 4 | ADDR0 | Address Bit 0 | | ... | ... | ... | | 256 | ADDR31 | Address Bit 31 |

Functional Features

• High-performance computing capabilities
• Integrated memory management unit (MMU)
• Multiple communication interfaces (UART, SPI, I2C)
• On-chip peripherals (timers, interrupt controller)
• Power management features for efficient energy usage

Advantages and Disadvantages

Advantages

• High processing power enables complex computations
• Low power consumption prolongs battery life in portable devices
• Compact size allows for integration in space-constrained applications
• Robust design ensures reliability in harsh environments

Disadvantages

• Limited cache memory may impact performance in certain applications
• Higher cost compared to lower-end microprocessors
• Requires expertise in embedded systems programming for optimal utilization

Working Principles

XPC850DEVR50BU operates based on the PowerPC architecture, utilizing a RISC instruction set. It executes instructions fetched from memory, performs calculations, and controls various peripherals to carry out desired tasks.

Detailed Application Field Plans

XPC850DEVR50BU finds applications in various fields, including: 1. Industrial automation 2. Automotive electronics 3. Medical devices 4. Communication systems 5. Aerospace and defense

In industrial automation, it can be used for real-time control of manufacturing processes. In automotive electronics, it can enable advanced driver assistance systems. In medical devices, it can provide computational capabilities for diagnostics and monitoring. In communication systems, it can handle data processing and network protocols. In aerospace and defense, it can be utilized for mission-critical applications.

Detailed and Complete Alternative Models

Some alternative models to XPC850DEVR50BU that offer similar functionality are: 1. XPC860ENZP50C1 - Clock Speed: 50 MHz, Package Type: PQFP (Plastic Quad Flat Pack) 2. MPC5200BVF400 - Clock Speed: 400 MHz, Architecture: PowerPC, Package Type: BGA 3. AT91SAM9G45-CU - Clock Speed: 400 MHz, Architecture: ARM, Package Type: LFBGA (Low Profile Fine-Pitch Ball Grid Array)

These alternative models provide comparable processing power and features, catering to different application requirements.

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